cystech electronics corp. spec. no. : c651i3 issued date : 2005.10.05 revised date :2009.02.04 page no. : 1/5 BTC5103I3 cystek product specification high speed switching transistor bv ceo 60v BTC5103I3 i c 5a r cesat 110m features ? low v ce (sat), v ce (sat)=0.33 v(typical), at i c / i b = 3a / 0.3a ? high switching speed ? wide soa ? complementary to bta1952i3 ? rohs compliant package symbol outline BTC5103I3 to-251 b c b base c collector e emitter b c e absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 100 v collector-emitter voltage v ceo 60 v emitter-base voltage v ebo 6 v collector current (dc) i c 5 collector current (pulse) i cp 9 *1 a power dissipation (t a =25 ) 1 power dissipation (t c =25 ) pd 30 *2 w junction temperature tj 150 c storage temperature tstg -55~+150 c note : *1. single pulse pw=100ms *2. printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm or larger
cystech electronics corp. spec. no. : c651i3 issued date : 2005.10.05 revised date :2009.02.04 page no. : 2/5 BTC5103I3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo 100 - - v i c =1ma, i e =0 bv ceo 60 - - v i c =1ma, i b =0 bv ebo 6 - - v i e =1ma, i c =0 i cbo - - 10 a v cb =100v, i e =0 i ebo - - 10 a v eb =5v, i c =0 *v ce(sat) - 0.33 0.4 v i c =3a, i b =0.3a *v be(sat) - - 1.2 v i c =3a, i b =0.3a *h fe 1 82 - 270 - v ce =2v, i c =1a *h fe 2 30 - - - v ce =2v, i c =3a f t - 30 - mhz v ce =5v, i c =1a, f=30mhz cob - 80 - pf v cb =10v, f=1mhz *pulse test : pulse width 380us, duty cycle 2% ordering information device package shipping marking BTC5103I3 to-251 (rohs compliant) 80 pcs / tube, 50 tubes / box c5103
cystech electronics corp. spec. no. : c651i3 issued date : 2005.10.05 revised date :2009.02.04 page no. : 3/5 BTC5103I3 cystek product specification characteristic curves current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) current gain---hfe vce=2v saturation voltage vs collector current 1 10 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) ic=10ib vce(sat) ic=20ib saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vbe(sat) @ ic=10ib on vottage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) on voltage---(mv) vbe(on)@vce=2v power derating curve 0 0.2 0.4 0.6 0.8 1 1.2 0 50 100 150 200 ambient temperature---ta() power dissipation---pd(w) power derating curve 0 5 10 15 20 25 30 35 0 50 100 150 200 case temperature---tc() power dissipation---pd(w)
cystech electronics corp. spec. no. : c651i3 issued date : 2005.10.05 revised date :2009.02.04 page no. : 4/5 BTC5103I3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cystech electronics corp. spec. no. : c651i3 issued date : 2005.10.05 revised date :2009.02.04 page no. : 5/5 BTC5103I3 cystek product specification o-251 dimension l he imete he imet t *: typica ers in c s mill rs in c s mill dim dim min. max. min. max. min. m . ax min. m . ax a 0.0177 0.0217 0.45 0.55 g 0.2 9 6 55 - .50 - b 0.0354 0.0591 0.90 1.50 h - *0.1811 - *4.60 c 0.0177 0.0236 0.45 0.60 i - 0.0449 - 1.14 d 0.0866 0.0945 2.20 2.40 j - 0.0346 - 0.88 e 0.2441 0.2677 6.20 6.80 k 0.2047 0.2165 5.20 5.50 f 0.2677 0.2835 6 .80 7.20 notes: aximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. there is any question with packing specification or packing method, please c ontact your local cystek sales office. ? lead: kfc; pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 1.controlling dimension: millimeters. 2.m 3.if material: ? ystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. c a e f g h j i 3 2 1 k c d b style: pin 1.base 2.collector 3.emitter 3-lead to-251 plastic package cystek packa g e code: i3 marking: c5103
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